⚡ Celebrating 40 Years of Electronics Innovation
NEPCON JAPAN 2026 (January 21–23) marks the 40th anniversary of Asia's leading electronics manufacturing and R&D trade show. Held at Tokyo Big Sight, this mega-event brings together 1,850 exhibitors from 30+ countries showcasing the latest in SMT, testing equipment, IC/sensor packaging, PCBs, semiconductors, automation, and wearable tech.
📅 Dates & Registration
Event Essentials
- Dates: January 21–23, 2026
- Venue: Tokyo Big Sight (East & West Halls)
- Exhibitors: 1,850 (450 new in 2026)
- Visitors: 92,000+ professionals
- Entry: Free with pre-registration
🔧 Core Technology Zones & Innovations
7 Specialized Concurrent Shows
- NEPCON JAPAN: SMT, testing, IC packaging, PCBs
- INTERNEPCON JAPAN: Production automation & smart factories
- Wearable EXPO: Sensors, textiles, device components
- Automotive World: EV & autonomous tech integration
- Electrotest Japan: Advanced inspection systems
- PWB Expo: High-density printed wiring boards
- IC & Sensor Packaging: Advanced semiconductor solutions
📊 2026 Highlights & Future Trends
- 200+ technical seminars forecasting electronics to 2050
- AI-powered defect detection & predictive maintenance
- Lab-grown materials & sustainable manufacturing
- Next-gen HDI/flexible PCBs for wearables & EVs
- Executive panels on global supply chain resilience
🎟️ Visitor Info & Why Attend
Ideal for procurement managers, engineers, R&D teams sourcing SMT equipment, IC packaging solutions, PCBs, testing systems, and wearable components.